Tai Nguyen So - Vietnam National University, Ha Noi

Browsing by Author Sarro P.M.

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Issue Date	Title	Author(s)
2003	High aspect ratio through-wafer interconnections for 3D-microsystems	Wang L.; Nichelatti A.; Schellevis H.; De Boer C.; Visser C.; Nguyen T.N.; Sarro P.M.
2006	Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging	Wang Z.; Wang L.; Nguyen N.T.; Wien W.A.H.; Schellevis H.; Sarro P.M.; Burghartz J.N.

Showing results 1 to 2 of 2