Cathodic arc plasma deposited TiAlSiN thin films using an Al-15 at.% Si cathode

Abstract

Thin films of TiAlSiN were deposited on SKD 11 tool steel substrates using two cathodes, of Ti and Al-15 at.% Si, in a cathodic arc plasma deposition system. The influence of AlSi cathode arc current and substrate bias voltage on the mechanical and structural properties of the films was investigated. The TiAlSiN films had a multilayered structure in which nanocrystalline cubic TiN layers alternated with nanocrystalline hexagonal AlSiN layers. The hardness of the films decreased with the increase of the AlSi cathode arc current. The hardness of the films also decreased as the bias voltage was raised from - 50 V to - 200 V. The maximum hardness of 43 GPa was observed at the films deposited at the pressure 0.4 Pa, Ti cathode arc current 55 A, Al cathode arc current 35 A, temperature 250 °C and bias voltage of - 50 V. © 2010 Elsevier B.V. All rights reserved.